Graphical Introduction of Interconnect and Packaging Technologies for Optoelectronic Devices. Invitation to Opto-Electronics.

Opto-Electronics Packaging And Failure Analysis Methodology

The demand for opto-electronics is increasing as we are nearing the future due to the need for high data rate, high bandwidth, lossless transmission and low electromagnetic interference sensitivity. The paper describes the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packa...

Molecular Electronics: From Devices and Interconnect to Circuits and Architecture

As the dominating CMOS technology is fast approaching a “brick wall,” new opportunities arise for competing solutions. Nanoelectronics has achieved several breakthroughs lately and promises to overcome many of the limitations intrinsic to current semiconductor approaches. Most of the results in this area reported until now focus on devices and interconnect; this work goes several steps further ...

New Packaging and Interconnect Technologies for Ultra Thin Chips

This paper shows different approaches to use the availability of ultrathin chips for the realization of new packages with high density and improved performance. For several years technologies have been developed for the embedding of chips in circuit boards in order to achieve 3D-packages using conventional processes from PCB manufacturing. Ultrathin chips are suited to be integrated in rigid ci...

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500°C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-...

Opto - Electronic Packaging